cystech electronics corp. spec. no. : c345s3 issued date : 2010.10.19 revised date : page no. : 1/6 RB715S3 cystek product specification small signal schottky diode RB715S3 description planar silicon schottky barrier diode encapsu lated in a sot-323 plastic smd package. features ? small surface mounting type (sc-70/sot-323). ?low reverse current and low forward voltage. ? high reliability. ?pb-free lead plating and halogen-free package. applications low current rectification and high speed switching. symbol outline sot-323 anode anode common cathode 1anode 2anode 3 common cathode RB715S3 ordering information device package shipping marking RB715S3 sot-323 (pb-free lead plating an d halogen-free package) 3000 pcs / tape & reel 3d
cystech electronics corp. spec. no. : c345s3 issued date : 2010.10.19 revised date : page no. : 2/6 RB715S3 cystek product specification absolute maximum ratings @t a =25 parameters symbol min max unit repetitive peak reverse voltage v rrm - 40 v reverse voltage(dc) v r - 40 v average rectified forward current i o - 30 ma repetitive peak forward current (60hz, 1 cyc) (note 1) i frm 200 ma total power dissipation p d 200 mw operating junction and storage temp erature range tj; tstg -40 +125 c note : 1.rating of per diode. characteristics (ta=25 c) characteristic symbol condition min. typ max. unit forward voltage v f i f =1ma - - 370 mv reverse leakage current i r v r =30v - - 0.5 a capacitance between terminals c t v r =1v, f=1mhz - 2 - pf thermal characteristics symbol parameter conditions value unit rth, j-a thermal resistance from junction to ambient note 1 500 /w recommended footprint
cystech electronics corp. spec. no. : c345s3 issued date : 2010.10.19 revised date : page no. : 3/6 RB715S3 cystek product specification typical characteristics forward current derating curve 0 20 40 60 80 100 120 0 25 50 75 100 125 150 ambient temperature---t a () percentage of rated forward current---(%) m ounting on glass epoxy pcbs forward current vs forward voltage 0.01 0.1 1 10 100 0 0.10.20.30.40 forward voltage---v f (v) forward current---i f (ma) .5 - 25 25 75 125 typ. pulse measurement reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 01 02 03 0 reverse voltage---vr(v) reverse leakage current---ir(a) ta= 75 ta= 25 ta= 125 ta=-25 typ. pulse easurement capacitance vs reverse voltage 1 10 0246810121 reverse voltage---v r (v) capacitance between terminals---c t (pf) 4 f=1mhz ta=25
cystech electronics corp. spec. no. : c345s3 issued date : 2010.10.19 revised date : page no. : 4/6 RB715S3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c345s3 issued date : 2010.10.19 revised date : page no. : 5/6 RB715S3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c345s3 issued date : 2010.10.19 revised date : page no. : 6/6 RB715S3 cystek product specification sot-323 dimension *: typical inches marking: te 3d 3-lead sot-323 plastic surface mounted package cystek package code: s3 style : pin 1. anode 2.anode 3. common cathode he e a a1 q lp e1 e bp 12 3 d w b v a z detail z a c 0 12 scale mm millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0315 0.0433 0.80 1.10 e1 0.0256 - 0.65 - a1 0.0000 0.0039 0.00 0.10 he 0.0787 0.0886 2.00 2.25 bp 0.0118 0.0157 0.30 0.40 lp 0.0059 0.0177 0.15 0.45 c 0.0039 0.0098 0.10 0.25 q 0.0051 0.0091 0.13 0.23 d 0.0709 0.0866 1.80 2.20 v 0.0079 - 0.2 - e 0.0453 0.0531 1.15 1.35 w 0.0079 - 0.2 - e 0.0512 - 1.3 - - - 10 0 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
|
